Multilayer PCB manufacturing process 10 layer PCB fabrication FR4 High TG

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Shenzhen Hengxunda Circuit Technology Co.,LTD

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Multilayer PCB manufacturing process 10 layer PCB fabrication FR4 High TG

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Multilayer PCB manufacturing process 10 layer PCB fabrication FR4 High TG

Process Capability And Checking Parameters(Rigid Board) NO ITEM Technical Capabilities 1 Layers 1-38L 2 Max.Board Size 1200*610mm 48"*24" 3 Finished Board Thickness 0.2mm--10.0mm 0.008"...

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