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Brand Name : hengsheng
Model Number : HS4015
MOQ : 1pcs
Price : 0.1usd per pcs
Payment Terms : T/T, Western Union,paypal
Supply Ability : 100000pcs per month
Delivery Time : 7-10work days
Packaging Details : Anti-static bubble film
Certification : UL, ROHS,SGS,ISO9001
Place of Origin : china
Base Material Thickness : 1.6mm
Copper Thickness : 1oz
Lead Time : 7-15 days
Manufacturing Process : SMT, DIP, AI
Material : FR4, Aluminum, Rogers
Max. Board Size : 1200mm*600mm
Max. Layer : 36
Min. Hole Size : 0.25mm
Min. Line Spacing : 0.1mm
Min. Line Width : 0.1mm
Product Name : PCB Assembly
Silkscreen Color : White, Black, Yellow
Solder Mask Color : Green, Blue, White
Surface Finishing : HASL, ENIG, OSP
| Process Capability And Checking Parameters(Rided Board) | |||||||
| NO | ITEM | Technical Capabilities | |||||
| 1 | Layers | 1-38L | |||||
| 2 | Max.Board Size | 1200*610mm | |||||
| 48"*24" | |||||||
| 3 | Finished Board Thickness | 0.2mm--10.0mm | |||||
| 0.008"--0.4" | |||||||
| 4 | Finished Copper Thickness | 17um-420um | |||||
| 0.5OZ--12OZ | |||||||
| 5 | Min.Trace Width/Space | 0.075mm/0.065mm | |||||
| 0.003"/0.0026" | |||||||
| 6 | Min.Hole Size | 0.15mm | |||||
| 0.006" | |||||||
| 7 | Hole Dim. Tolerance(PTH) | ±0.05mm | |||||
| ±0.002" | |||||||
| 8 | Hole Dim.Tolerance(NPTH) | ±0.05mm | |||||
| ±0.002" | |||||||
| 9 | Drill Location Tolerance | ±0.05mm | |||||
| ±0.002" | |||||||
| 10 | V-Cut Degrees | 20-90 ºC | |||||
| 20DEG-90DEG | |||||||
| 11 | Min.V-Cut PCB Thickness | 0.4mm | |||||
| 0.016" | |||||||
| 12 | N/C Routing Tolerance | ±0.1mm | |||||
| ±0.004" | |||||||
| 13 | Min.Blind/Buried Via | 0.15mm | |||||
| 0.06" | |||||||
| 14 | Plug Hole Size | 0.2mm--0.6mm | |||||
| 0.008"--0.024" | |||||||
| 15 | Min.BGA PAD | 0.2mm | |||||
| 0.008" | |||||||
| 16 | Materials | FR4(TG130-TG170),Aluminium,Halogen-free,Rogers,ShengYi,KB | |||||
| 17 | Surface Finish | HASL-LF,ENIG,ImAg,ImSn,OSP,Gold platting, ENIG+OSP,HAL+G/F | |||||
| 18 | Warp & Twist | ≤0.75% | |||||
| 19 | Electrical Testing | 50--300V | |||||
| 20 | Solderability Testing | 245±5ºC,3sec Wetting area least95% | |||||
| 21 | Thermal Cycling Testing | 288±5ºC,10sec,3cycles | |||||
| 22 | Ionic Contamination Testing | Pb,Hg,Cd,Cr(VI),PBB,PBDE six items are less than 1000ppm | |||||
| 23 | Soldmask Adhesion Testing | 260ºC+/-5, 10S,3times | |||||


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